IEEE Symposium on Low-Power and High-Speed Chips and Systems (COOL Chips 29)

IEEE COOL Chips is an International Symposium initiated in 1998 to present advancement of low-power and high-speed chips and systems. The symposium covers leading-edge technologies in all areas of microprocessors and their applications. The COOL Chips 29 is to be held on April 15-17, 2026 in Tokyo.

All papers are published online via IEEE Xplore. Especially, selected papers are encouraged to submit to the IEEE Micro and the special section in the IEICE Transactions on Electronics.

Contributions are solicited in the following areas:

Low Power-High Performance Processors for AI, IoT, Multimedia, Digital Consumer Electronics, Mobile, Graphics, Encryption, Robotics, Automotive, Networking, Medical, Healthcare, and Biometrics.
Novel Architectures and Schemes for Single Core, Multi/Many-Core, NoC, Embedded Systems, Reconfigurable Computing, Grid, Ubiquitous, Dependable Computing, GALS and 3D Integration.
Cool Software including Parallel Schedulers, Embedded Real-time Operating System, Binary Translations, Compiler Issues and Low Power Application Techniques.

Proposals should be organized in a full paper format (6 pages) or an extended abstract format (up to 3 pages) describing the topic to be presented. Both full papers and extended abstracts will be reviewed and judged under the same criteria (originality, significance, technical soundness, and superiority of results) and selected to deliver a more attractive program for the audience.

🏷️ Conference | Devices & Microelectronics